Join a sensor manufacturing team using nanoengineered semiconductor technology to execute manufacturing plans, meet production targets, and further develop the manufacturing technology.

Duties:

*** Lead sensor manufacturing program for entire manufacturing line from wafer to package.

*** Support sensor design and testing teams to develop new sensor architectures and improve performance.

*** Design new process flows, including developing and optimizing various semiconductor processes such as UV projection lithography, reactive-ion and inductively coupled plasma etching, physical and chemical vapor depositions, e-beam deposition, sputtering, wafer dicing, and packaging.

*** Troubleshoot process and material related problems to ensure desired yields.

*** Assist in foundry-transition of production during scaling.

Join a company with high employee ratings for compensation, advancement potential, job satisfaction, and benefits. Opportunity to earn a six figure salary with annual performance bonus and full medical, dental, and vision plans for whole family. Short and long-term disability, group term life insurance, and more!

For complete details contact James A. Lockley, LT USN (Ret) at:
(609) 584-9000 ext 278

Or, submit resume online at:
http://dmc9.com/jal/app.asp

Or, email to:
1000030838_10007183@jobbank301.com

Please reference #37764164 when responding.

2+ years

New Jersey

$70,000.00

$80,000.00

James Lockley

609.584.9000 x278

1000030838_10007183@jobbank301.com

http://dmc9.com/jal/app.asp

Diedre Moire Corporation, Inc.
diedremoire.com

WE ARE AN EQUAL OPPORTUNITY EMPLOYER and our employment decisions are made without regard to race, color, religion, age, sex, national origin, handicap, disability or marital status. We reasonably accommodate individuals with handicaps, disabilities and bona fide religious beliefs. Jobs Career Position Hiring. CONSIDERED EXPERIENCE INCLUDES: http://najobbank.com www.najobbank.com Top 10 Job Site Top 10 Careers Site Semiconductors Wafer Fabrication Laser Diodes Manufacturing Process Improvement Integration Engineer Continuous Improvement Failure Analysis Root Cause Analysis Workflow UV Projection Photolithography Reactive-ion Etching REI Inductively Coupled Plasma ICP Physical Vapor Deposition Chemical Vapor Deposition E-Beam Deposition Dry Etching Wet Chemical Etching Spin-on Dielectrics Plasma Cleaning Metal Deposition Mask Design Sputtering Wafer Dicing

DISCLAIMER: We will make every effort to consider applications for all available positions and shall use one or more of the contact methods and addresses indicated in resume or online application. Indicated location may be proximate or may be desirable point of embarkation for paid or unpaid relocation to another venue. Job descriptions may fit single or multiple presently available or anticipated positions and are NOT an offer of employment or contract implied or otherwise. Described compensation is not definite nor precise and may be estimated and approximate and is negotiable depending on market conditions and candidate availability and other factors and is solely at the discretion of employers. Linguistics used herein may use First Person Singular and First Person Plural grammatical person construction for and with the meaning of Third Person Singular and Third Person Plural references. We reserves the right to amend and change responsibilities to meet business and organizational needs as necessary. Response to a specific posting or advertisement may result in consideration for other opportunities and not necessarily the incentive or basis of the response. Nothing herein is or may be considered a promise, guarantee, offer, pledge, agreement, contract, or oath.

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