Seeking back-end process packaging engineer to support manufacturing and development of semiconductor-based optics and optoelectronic components, photonics, and electronic integrated circuit technologies.

Duties:

*** Sustain process and equipment for wafer back-end manufacturing processes, such as die singulation, pick and place and sorting, wire bonding, flip chip die bonding, underfills, encapsulation molding. micro-dispensing, optical alignment, polishing, hermetic packaging and final printed circuit board laminate assembly.

*** Define and develop package assembly process flow, material set, test vehicle, Design of Experiments, process control plans to sustain reliable manufacturable products.

*** Manage the production and prototype lines to meet production matrices including yields, cost, cycle time, on-time delivery, engineering change order, statistical process control and analysis, work instructions, corrective actions, operators training, Work-in-Process management, process flow, and other documentations and logistics.

*** Analyze, troubleshoot and recommend corrective actions for quality issues related to problems of upstream fab manufacturing processes.

Qualifications:

*** Degree in Chemical Engineering, Materials Science, Electrical Engineering, or related discipline with 3+ years of relevant experience.

*** Technical background in optoelectronics or semiconductor device packaging.

Excellent opportunity to join strong, growing company with modern up-to-date technology. Competitive hourly rates with potential bonuses. Superior benefits include full family health insurance coverage, disability insurance, vacation days, paid holidays, life insurance, paid time off, tuition reimbursement, and much more.

For complete details contact James A. Lockley, LT USN (Ret) at:
(609) 584-9000 ext 278

Or, submit resume online at:
http://dmc9.com/jal/app.asp

Or, email to:
1000028722_10007183@jobbank301.com

Please reference #37483276 when responding.

5+ years

New Jersey

$80,000.00

$120,000.00

James Lockley

609.584.9000 x278

1000028722_10007183@jobbank301.com

http://dmc9.com/jal/app.asp

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