Promote the packaging portfolio to customers and market a wide portfolio of products and differentiating technologies to secure new design wins, then work with Sales, R&D, and factory engineering teams to translate the design wins into qualified, revenue-generating products.

Shall:

*** Provide direction, management, and internal and external communication for new semiconductor devices, package applications, and technical manufacturing with end customers resulting in new design wins, successful qualifications, and revenue growth.

*** Obtain and construct customer product and packaging technology designs.

*** Align customer roadmaps with internal product, engineering and development groups and update designs.

*** Identify gaps between customer and internal designs and work with R&D and Technology teams to close the gaps.

*** Understand and support sales on construction of or obtaining customer product designs to support sales strategy.

*** Analyze customer product and technology needs to drive new design wins on a pro-active basis.

*** Guide customer to adopt company packaging and Test solutions.

*** Intercept, understand, collaborate on business implications, channel to & guide the right internal teams to answer and respond to customer regarding all technical inquiries originating from the customer.

*** Organize, prepare for and attend important customer quality and engineering visits to factories.

*** Manage customer escalations in special situations ensuring the right level of attention and intervention.

*** Ensure factory has customer design docs and obtain cost estimates from factory for sales to quote to customer.

Familiarity in the Following Areas is Beneficial:

*** Flip chip and wafer level package applications in Mobile, Automotive, Computing, and other applications.

*** Wafer Bumping including plating, printing, etc.

*** Assembly process technologies: chip attach, under fill, heat spreader etc.

*** Substrate technologies: build-up, laminate, etc.

*** Reliability, Metrology and F&A methodologies.

*** Package design & Simulation processes and tools.

*** Marketing and customer facing experience in the Semiconductor packaging Industry.

Enjoy the career path opportunities that only a growing global company can provide while earning a top compensation, bonuses, executive perquisites and full company paid benefits - Medical, dental and a vision plan, prescription drug plan, flexible spending account, short and long-term disability coverage, 401(k) plan with dollar-for-dollar company match, discount stock purchase plan, accidental death & disability insurance, expense account, and more.

For complete details contact James A. Lockley, LT USN (Ret) at:
(609) 584-9000 ext 278

Or, submit resume online at:
http://dmc9.com/jal/app.asp

Or, email to:
1000036697_10007183@jobbank301.com

Please reference #38376171 when responding.

5+ years

New Jersey

$100,000.00

$140,000.00

James Lockley

(609) 584-9000 ext 278

1000036697_10007183@jobbank301.com

http://dmc9.com/jal/app.asp

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