Seeking an Engineer with Optoelectronic packaging experience to lead develop and implementation of new laser diode packaging technologies and methods.

Responsibilities:

*** Investigate, develop, and maintain packaging methods for low and high power, edge emitting semiconductor lasers.

*** Oversee diode fabrication team to ensure reliability, quality, and performance standard adherence.

*** Assess and develop diagnostics for packaging steps performance.

*** Implement laser diode packaging precision alignment strategies such as: die bonding (soldering, epoxy, or similar), Optical Coupling, Thermal Performance Optimization, Package sealing, Wire bonding, and similar.

*** Conduct package quality assessment & verification and reliability tests.

Requirements:

*** Masters in Mechanical Engineering, Materials Engineering, Optical Engineering, Physics, or similar field.

*** 5+ years of Design and Fabrication experience of packaged assemblies for laser diodes.

*** Experience with Optical and Thermomechanical design.

*** Ability to handle and characterize semiconductor laser diodes.

*** Knowledge of Die Bonding technologies, Semi-Automated & Automated Assembly tools, and similar backend assembly processes for microelectronics.

Innovative industry leader offers a competitive compensation package commensurate with experiences, bonuses, tuition reimbursement, full medical coverage, 401(k) with company match, health and wellness benefits, generous paid vacation, numerous personal and professional development opportunities, and more!

For complete details contact James A. Lockley, LT USN (Ret) at:
(609) 584-9000 ext 278

Or, submit resume online at:
http://dmc9.com/jal/app.asp

Or, email to:
1000035376_10007183@jobbank301.com

Please reference #38376192 when responding.

5+ years

New Jersey

$100,000.00

$180,000.00

James Lockley

(609) 584-9000 x278

1000035376_10007183@jobbank301.com

http://dmc9.com/jal/app.asp

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